I'm looking at a Sempron for a budget PC I'm planning. The CPU comes with a stock heatsink and fan that according to reviews is pretty good and keeps it very cool. I'm wondering if I should replace the pad with AS5 or leave the pad on it. Do you need to reappy AS5 every so often? I've heard varying opinions on this. If so I'll just stick with the pad since the PC won't be mine and I won't be around to maintain it.
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personally =- if not overclocking and also since its not yours , keep the pad on it ..
that way there is no issue of warrenty problems and the pads work fine at stock speeds - the ones that come with retail kits .."Each problem that I solved became a rule which served afterwards to solve other problems." - Rene Descartes (1596-1650) -
I would go with the pad for that setup. Just run the PC for about an hour or two and check the temp through BIOS and the pad should be 'melted' in properly.
I have also heard about reapplying thermal paste. I have ran some CPU coolers for a year or two and pulled them off. No sign of failed paste. I reapply it and check temps, no change. I suppose if overclocking or higher than normal CPU temps it might be a good idea. Keeping track of your CPU temps would tell you if it might help to renew the paste. -
Thanks for the info. I was also wondering for another rig that I one day intend to build. I plan on running stock speeds on that too so I'll probably stay with pads unless I decide to overclock anything.
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Leave the pads unless you are considering overclocking. I use AS5, and it is excellent.
As for re-application, that's a load of rubbish. Once the thermal compound has bedded in, what could be worse than disturbing it? It doesn't go anywhere, doesn't dry out... Just leave it be once it is on! -
that pad is worthless. why not spend a few bucks to keep your cpu running cool?
PhenII 955@3.74 - GA-790XTA-UD4 AM3 - 2x4 Corsair Vengeance@1600 - Radeon 5770 - Corsair 550VX - OCZ Agility 3 90GB WD BLACK 1TB - LiteOn 24x - Win 8 Preview - Logi G110+G500 -
it runs perfectly cool with the pad - and if AS is not applied correctly or shorts out the pins .. you are in worse shape , plus you could lose a warrenty ..
AS is good for overclocking .... true"Each problem that I solved became a rule which served afterwards to solve other problems." - Rene Descartes (1596-1650) -
i wouldnt say perfectly cool but yeah it works... maybe it's just bein from the desert seeing how heat wears down on anything over time. i'll take a few degrees lower if i can. but thats just me.
PhenII 955@3.74 - GA-790XTA-UD4 AM3 - 2x4 Corsair Vengeance@1600 - Radeon 5770 - Corsair 550VX - OCZ Agility 3 90GB WD BLACK 1TB - LiteOn 24x - Win 8 Preview - Logi G110+G500 -
from the desert
yea -- that can make a diff ..
but you know how many people have FU their cpu's ....
or at the least, dont apply it right and just glob on a wad of it w/o cleaning and polishing the contact areas ..."Each problem that I solved became a rule which served afterwards to solve other problems." - Rene Descartes (1596-1650) -
yeah. or put too much and drown the chip. but you gotta learn how to do it sometime. ya know.
PhenII 955@3.74 - GA-790XTA-UD4 AM3 - 2x4 Corsair Vengeance@1600 - Radeon 5770 - Corsair 550VX - OCZ Agility 3 90GB WD BLACK 1TB - LiteOn 24x - Win 8 Preview - Logi G110+G500 -
Well I've already read up on AS5 website about application methods. But I don't think it's necessary for this. Its a Sempron chips, based of the 64 series not the XP and from all reports I've seen it runs very cool with stock cooling. It'll have a 120mm case fan right beside it as well. Just thought I'd check beforehand though.
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yea - those run cool i heard also
"Each problem that I solved became a rule which served afterwards to solve other problems." - Rene Descartes (1596-1650) -
Why doesn't anyone use Arctic Alumina, the ceramic-based thermal compound by the makers of AS? It works just as well and isn't conductive so you can be a little sloppy with it. Just another option if you're nervous about bridging something with AS.
FB-DIMM are the real cause of global warming
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