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WE'VE HAD a good chat to some thermal guys here at IDF who were keen to show us their prototype designs for the dual-core Montecito chip. You can see pictures of the heatsink, later.
They told us that they are working on dissipating 150-200W of heat for Montecito, and that to do that in the small space required for server applications requires the use of a TEC (Thermo-Electrical Conductor). TECs have previously been the realm of hardcore overclockers who want to drive their chips to insane levels of performance.
We asked if the TEC was something fancy, or if it was really required to get the required amount of dissipation out of a heatsink for Montecito. We were told in no uncertain terms that it was an absolute necessity.
If this is true, it's unbelievable. We have heard Bill Siu say that Montecito will have less than double the power requirements of a single chip. If what we've seen today pans out in the market, it might only be a little less - maybe 150-180W. That's a heck of a lot of heat to be putting in a server box.
Here are some pictures of the heatsink design (which you can clearly see if oblong, to accommodate the dual core). You can also see the electrical wires for connecting to the TEC.
You'll have to wait a little later for the pics, OK? -
TEC. Do those use Peltier Effect junctions?
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