I have a 960T CPU and an EVO HSF (CDC) and I would like to know what is the recommended way to apply the Prolimatech PK-1 (1gram BTW) on the CPU and HS and also what method do you apply?
Prolimatech's website FAQ recommends to 'please spread out evenly a thin layer of PK-1 onto the whole CPU and to the whole heatsink base bottom.'
Based on their recommendation I assume the following method is appropriate:
There are other methods I can try like dot, line or x-method.To apply; simply heat the tube by running under hot water from the tap. Wipe it dry.
Get the thinnest plastic bag you can find (freezer bags are ideal), and cover your hand.
Apply a rice-grain size of the warm paste to the centre of the CPU heat spreader. Holding the CPU in one hand, GENTLY rub the paste using a circular motion, across the surface with your index finger (through the plastic bag). Just use VERY light pressure and massage it in until the surface is covered completely.
After rubbing for about 15 seconds, the heat from your finger softens the paste and eventually, it leaves behind a nice thin haze on the heat spreader.
Wait one minute and repeated the process to get a slightly thicker coat and then do the same thing to the bottom of the heat sink.
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"A computer is never finished, you just run out of money."
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i've always used the method they recommend, even if the thermal paste/grease wanted it the other ways. never had a problem and always have good coverage. just one coat though on each part though.
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"a lot of people are better dead" - prisoner KSC2-303 -
I don't disagree with you. I think I might try both ways, somewhat...
Because i emailed Prolimatech Tech support and they said:
Dear sir,
After checking with our engineers about the spread application method, our engineers suggest to apply PK-1 to evenly a layer which is not thin (vaguely seen).
We've modified our website's FAQ (from a thin layer to a layer).
Since PK-1's thermal conductivity is very good (http://www.prolimatech.com/en/products/detail.asp?id=163&subid=1528#showtab), our engineers suggest to apply a layer on both CPU and heatsink which will have better performance.
If you like, you may apply a thick layer; however, a normal vaguely layer is enough. (thick layer means waste of the thermal compound)
About your question of spread application method may introduce the possibility of air bubbles, our engineers' reply as follows:
We've tried both ways (a dot in the center and spread it on both CPU and Heatsink) and found both ways have similar performance.
Best regards,
**************************************
Selena Lee
Prolimatech Co.,LTD.
E-mail:*************
Visit our Website at: www.prolimatech.com
Facebook: http://www.facebook.com/pages/Prolimatech-Co-LTD/143936609425
Twitter: https://twitter.com/#!/Prolimatech
****************************************
I guess I would try spreading a thin layer on the heatsink and next removing the entire layer but leave a translucent haze that covers the microscopic holes and then applying the dot method on the CPU (or X method to cover more area if I have enough paste remaining.)"A computer is never finished, you just run out of money." -
When they recommand to apply compound to both surfaces, they don't mean to spread it on both surfaces. You're supposed to spread a thin coat over the CPU (should be as thin as possible, you can almost see through it). My prefered method is to wrap a finger in plastic (bag, wrap, whatever), place a drop the size of a grain of rice on the CPU, then spread it evenly, from the center out in all directions. Use the edge of the finger to gather the excess, then smear the bottom of the heatsink. The purpose here is not to have it look like the job you did to the CPU, instead you just want to fill any line or marks in the metal, where the two will touch.
And be careful with electrically conductive compound, too much can ooze out and cause a short circuit. Smearing the board or wrong side of the CPU is bad too.Last edited by nic2k4; 4th Apr 2012 at 18:53.
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they do mean spread it thinly on both the cpu and the heatsink or thickly if you can't get the hang of spreading it. the heat and pressure from the attachment springs will take care of evening out any lumps you leave. better too much that spread out and off the cpu than too little and burning up a cpu.
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"a lot of people are better dead" - prisoner KSC2-303 -
Take it from the fish, with heatsink compound, less is better (and if it's electrically conductive, it's a must):
- Conventional heatsink: http://www.hardwaresecrets.com/article/What-is-the-Best-Way-to-Apply-Thermal-Grease-Part-1/1303/1
- Heatpipe heatsink: http://www.hardwaresecrets.com/article/What-is-the-Best-Way-to-Apply-Thermal-Grease-Part-2/1392/1
It's preferable not to goop up both surfaces as this increases the chances of trapping air bubbles.
Here's a good guide: http://www.hardwaresecrets.com/article/How-To-Correctly-Apply-Thermal-Grease/274/1
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